Compared to traditional sensors, microsensors have many new characteristics. They can compensate for the shortcomings of traditional sensors and have a wide range of application prospects, increasingly gaining attention. As a new generation of sensor devices prepared using standard process-compatible materials through MEMS processing technology, they feature miniaturization and integration, which can greatly improve sensor performance. In terms of signal transmission, they can reduce interference and noise, improve the signal-to-noise ratio, reduce errors, and enhance sensitivity.

he existing assembly process for microsensors is all done manually. Due to the assembly process, this results in poor assembly precision, low efficiency, etc., and cannot achieve efficient, high-precision, low-cost mass production.