Mini-LED Glue Defect Inspection Equipment
This is an intelligent visual dimension measurement system developed by Dingna for the electronics industry, specifically for portable laptops and Pad Mini LED glue boards. It is primarily designed to address the size and defect inspection needs related to glue width, glue height, offset, and overflow in Mini LED glue boards. The system utilizes visual imaging detection technology to measure parameters such as glue width, glue height, offset, and overflow.