Mini-LED Glue Defect Inspection Equipment

Mini-LED Glue Defect Inspection Equipment

This is an intelligent visual dimension measurement system developed by Dingna for the electronics industry, specifically for portable laptops and Pad Mini LED glue boards. It is primarily designed to address the size and defect inspection needs related to glue width, glue height, offset, and overflow in Mini LED glue boards. The system utilizes visual imaging detection technology to measure parameters such as glue width, glue height, offset, and overflow.
  • Main Inspection Focus: Glue width, glue height, offset, and overflow
  • Compatibility:Compatible with various product sizes
  • Stability:Stable operation with 4.5k inspections per day without mechanical faults

  • Speed:Fast inspection speed with a pass-through inspection method, cycle time (CT) = 18s/pcs

  • Detection Type

    Glue width, glue height, offset, overflow
  • Minimum Accuracy

    0.01mm
  • Detection Speed

    18s/PCS
  • Maximum Detection Size

    367*251mm
  • Applicable Products

    Laptops, Pad Mini LED glue boards
  • Detection Method

    Online/Offline
  • Camera

    Industrial Camera, Laser
  • Detection System

    DN software platform

Application Case

Mini-LED Glue Defect Inspection Equipment

This intelligent visual dimension measurement system is developed for the electronics industry, specifically for portable laptops and Pad Mini LED glue boards. It primarily addresses the size and defect inspection needs related to glue width, glue height, offset, and overflow in Mini LED glue boards. The system utilizes visual imaging detection technology to measure these parameters.

Product Application Case:Portable PAD, laptop production line.

Consultation Contact Us

  • Phone

    0512-66957689
  • Address

    No. 11 Tingxin Street, Industrial Park, Suzhou
  • Email

    info@dinnar.com