Microsensor Assembly Line

Microsensor Assembly Line

Compared to traditional sensors, microsensors have many new characteristics. They can compensate for the shortcomings of traditional sensors and have a wide range of application prospects, increasingly gaining attention. As a new generation of sensor devices prepared using standard process-compatible materials through MEMS processing technology, they feature miniaturization and integration, which can greatly improve sensor performance. In terms of signal transmission, they can reduce interference and noise, improve the signal-to-noise ratio, reduce errors, and enhance sensitivity.
he existing assembly process for microsensors is all done manually. Due to the assembly process, this results in poor assembly precision, low efficiency, etc., and cannot achieve efficient, high-precision, low-cost mass production.
  • Strong compatibility: The line can assemble products with and without tubes, compatible with different sizes.
  • Non-stop TRAY replacement: Can achieve online non-stop replacement of full and empty trays.
  • Stable operation: Performs 80K inspections daily without mechanical failures.
  • High capacity: Manual assembly by the customer side is 80pcs/person.day, the line uses multi-station operation, UPH1200.
  • High precision: The finished product is composed of 12 parts, dimensions 2.7*4.9mm, laser cutting 0.015mm, gluing 0.3mm glue width, assembly precision ±0.02mm, laser welding 0.2mm.
  • Multiple stations: The entire line equipment integrates laser cutting, airtightness, upper and lower CCD mounting, gluing, laser welding, resistance welding, soldering, functional testing, CCD appearance inspection, CCD dimension inspection, totaling 13 stations.
  • Line process

    Laser cutting, airtightness testing, upper and lower CCD mounting, gluing, laser welding, resistance welding, soldering, functional testing, CCD appearance inspection, CCD dimension inspection, etc.
  • Minimum assembly precision

    ±0.02mm
  • High output

    UPH1200
  • Minimum finished product size

    2.5*4mm
  • Applicable products

    Acoustic microsensor assembly
  • Loading and unloading method

    Online, non-stop
  • Software system

    DN software platform

Application Case

Microsensor assembly line

Compared to traditional sensors, microsensors have many new characteristics. They can compensate for the shortcomings of traditional sensors and have a wide range of application prospects, increasingly gaining attention. As a new generation of sensor devices prepared using standard process-compatible materials through MEMS processing technology, they feature miniaturization and integration, which can greatly improve sensor performance. In terms of signal transmission, they can reduce interference and noise, improve the signal-to-noise ratio, reduce errors, and enhance sensitivity. The existing assembly process for microsensors is all done manually. Due to the assembly process, this results in poor assembly precision, low efficiency, etc., and cannot achieve efficient, high-precision, low-cost mass production.

Product application case:Microsensor assembly line.

Consultation Contact Us

  • Phone

    0512-66957689
  • Address

    No. 11 Tingxin Street, Industrial Park, Suzhou
  • Email

    info@dinnar.com